PCB and Surface-Mount Technology Assembly
Understand the production flow for printed-circuit-board assembly including solder paste, component placement, reflow and basic inspection.
Work context
Electronics manufacturing
This page shows technical knowledge coverage. Course, assessment and credential availability depends on the applicable Industrial Skillset program.
Relevant roles
Electronics technicians · SMT operators · Quality inspectors · Manufacturing engineers
Prerequisites
ESD control · Basic electronics awareness
Knowledge level
Intermediate coverage with practical workplace context.
Learning outcomes
What this topic is intended to help you understand
- Trace a basic SMT assembly flow.
- Identify stencil, placement and reflow functions.
- Recognize common placement and solder defects.
Technical scope
Equipment, processes and terminology
- PCB handling
- Solder paste
- Stencils
- Pick-and-place
- Reflow ovens
- AOI concepts
- Through-hole integration
- Component polarity
Workplace practice
How the subject connects to industrial work
- ESD verification
- Material and revision checks
- Feeder/setup verification
- Visual/AOI review
Quality and safety
Controls that protect people, product and process
- ESD control
- Fume extraction
- Hot surfaces
- Lead-free process awareness
Technical learning supports understanding. Actual work remains governed by site procedures, machine-specific instructions, engineering requirements, supervision and authorization.
Industrial documents
Documents commonly connected to this subject
- BOM
- Assembly drawing
- Placement file
- Work instruction
- Inspection criteria